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MF228 850 nm, 50 MHz High Performance LED Data Sheet October 2004 Ordering Information MF228 MF228 MF228 MF228 MF228 ST SC SMA FC TO-46 Package ST Housing SC Housing SMA Housing FC Housing -40 C to +85 C Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less Features * * * * 850 nm Surface-Emitting LED 70 MHz Bandwidth Uniform phase distribution Designed for 200/280 m fiber Description This device is capable of providing high power into large-core fiber over a wide temperature range. Thanks to its very uniform phase distribution of the optical power, it is ideal for Electronic Distance Measurement equipment. Applications * * * Electronic Distance Measurement (EDM) Sensors Avionics CASE CATHODE ANODE CATHODE ANODE Bottom View Anode in electrical contact with the case Figure 1 - Pin Diagram Figure 2 - Functional Schematic 1 Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2001-2004, Zarlink Semiconductor Inc. All Rights Reserved. MF228 Optical and Electrical Characteristics - Case Temperature 25C Parameter Fiber-Coupled Power (Figures 3, 4, and 5) (Table 1) Rise and Fall Time (10-90%) Bandwidth (3dBel) Peak Wavelength Spectral Width (FWHM) Forward Voltage (Figure 7) Reverse Current Capacitance Note 1: Data Sheet Symbol Pfiber tr,tf fc p VF IR C Min. 1000 Typ. 1200 7 50 Max. Unit W Test Condition IF = 100 mA (Note 1) IF = 100 mA (no bias) IF = 100 mA IF = 100 mA IF = 100 mA IF = 100 mA VR = 1 V VR-0 V, f = 1 MHz Fiber: 200/280 m Step Index NA = 0.24 10 ns MHz 830 850 50 1.8 250 870 2.2 20 nm nm V A pF Measured at the exit of 100 meters of fiber. Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature (derating: Figure 6) Electrical Power Dissipation (derating: Figure 6) Continuous Forward Current (f<10 kHz) Peak Forward Current (duty cycle<50%,f>1 MHz Reverse Voltage Soldering Temperature (2mm from the case for 10 sec.) Thermal Characteristics Parameter Thermal Resistance - Infinite Heat Sink Thermal Resistance - No Heat Sink Temperature Coefficient - Optical Power Temperature Coefficient - Wavelength Symbol Rthjc Rthja dP/dTj d/dTj -0.4 0.3 Min. Typ. Max. 100 400 Unit Symbol Tstg Top Ptot IF IFRM VR Tsld Limit -55 to +125C -40 to +85C 250 mW 110 mA 180 mA 1.5 V 260C C/W C/W %/C nm/C Typical Fiber-Coupled Power Core Diameter/Cladding Diameter Numerical Aperture 50/125 m 0.20 60 W 62.5/125 m 0.275 150 W 100/140 m 0.29 450W 200/230 m 0.37 1300 W 200/280 m 0.24 1200 W 2 Zarlink Semiconductor Inc. MF228 Data Sheet r 100 90 Relative Fiber-Coupled Power (%) 80 70 60 50 40 30 20 10 0 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3 z r - optimal OC = 200 m z - Axial Displacem ent of Fiber (m) (m ) Figure 3 - Relative Fiber-coupled Power vs. z - Axial Displacement of Fiber 100 z % r Relative Fiber-Coupled Power (%) 80 z - optimal OC = 200 m 60 40 20 0 0 20 40 60 80 100 120 140 160 180 200 r - Radial Displacem ent of Fiber ( m ) Figure 4 - Felative Fiber-coupled Power vs. r - Radial Displacement of Fiber 3 Zarlink Semiconductor Inc. MF228 Data Sheet 100 90 Relative Fiber-Coupled Power (%) 80 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 140 160 180 200 Forward Current (mA) Heat Sinked DC 50% Duty Cycle Figure 5 - Relative Fiber-coupled Power vs. Forward Current 300 Note: Maximum junction temperature can be increased to 150 C after additional burn-in and screening. Max. Electrical Power Dissipation (mV) 250 200 Infinite Heat Sink 150 No Heat Sink 100 50 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Operating Tem perature ( oC) Figure 6 - Max. Electrical Power Disapation vs. Operating Temperature 4 Zarlink Semiconductor Inc. MF228 Data Sheet 200 150 Forward Current (mA) 100 50 0 0 0.5 1 1.5 Forw ard Voltage (V) 2 2.5 3 Figure 7 - Forward Current vs. Forward Voltage 200 Note: Dashed line indicate that the pow er dissipation may exceed the maximum ratings. a b Heat Sinked 120 c 160 Peak Forward Current (mA) d 80 a) b) c) d) P fiber P fiber P fiber P fiber = const.1450 W peak = const.1200 W peak = const.950 W peak = const.700 W peak 40 0 -60 -40 -20 0 20 40 60 O 80 100 120 140 Operating Tem perature ( C) Figure 8 - Peak Forward Current vs. Operating Temperature 5 Zarlink Semiconductor Inc. For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively "Zarlink") is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink's conditions of sale which are available on request. Purchase of Zarlink's I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE |
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